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Loctite ® 0430™ Hysol ® SprayPac ® Polyshot™ Hot Melt Adhesive

Loctite ® 0430™ Hysol ® SprayPac ® Polyshot™ Hot Melt Adhesive is suitable for bonding expanded polystyrene, polyethelene, and urethane foams. Can be used in applications where solvent-based aerosols are used.

Chemistry Poly ethylene vinyl acetate
Media Carrier 100 % solid (incl. Hotmelt)
Cure Type Heat cure
RoHS Compliant Contact Henkel